In 1970, Lanzhou
RAPID have researched and developed the first generation of
materials preparation equipment (C66 100/YJ silicon slice chamfering
machine, C63 305-2/YJ polishing machine, C6268-1/YJ whetting
machine, C61 305/YJ automatic adhibit machine, C65 820/YJ single
side attenuate machine); In early 1980s, researched and developed
C62 75-2/YJ four path whetting machine (9S), it won the quality
product award of Electron Industry deaprtment in 1985 and become
the industry appointed extending to substitute the imported
electron material whetting equipment. And also researched and
developed othe special equipment like C62-165/YJ double side
whetting-polishing machine, C64 300/YJ precision whetting polishing
machine, Y05 30-2/YJ muti-detect pin micro-motion instrument,
C67 100/Yj silicon bar cut machine; In mid 1980s, researched
and develop C62 1115-2/YJ quarter motion whetting machine, which
applied to computer disk and other materials whetting; In early
1990, to meet the rapid development of the crystal industry
demand, successively exploited and manufactured C62 265/YJ high
speed whetting machine(4S), C62 560-2/YJ muti-reamer cut machine,
the market starve equipment. In the end of 1990, to applied
with the big diameter silicon slice demand of market development,
exploited and manufactured the C62 640B-1/YJ whetting maching,
and increased the electric control level largely(adopted PLC
and PT control technic)£¬exploited X61 850B-1 whetting machine(12B¡ªawarded
the national emphases new product prize) X61 1112B-1 whetting
machine(16B), X62 1355B-1 whetting machine(20B, national emphases
new product award), X62 305-1 silco dioxide polishing machine,
X62 485-1 polishing equipment, etc.
At present, have become the ¡°S¡± and
¡°B¡± two main series whetting equipment, satisfy the semiconductor
silicon industry belw 6¡± whetting, polishing equipment market
demand, setup the stronge manufacture assemble capacity, in
¡°B¡± series, the producing and developing of whetting maching
can compare with other company¡¯s in the world, whatever in whole
machine operation precision or electric control. With ethe rapid
develoment of the IT flat disply, our company succesively researched
and developed the STN-LCD polishing machine( X62 800-2/900-2
glass fine polishing machine, award the science and technology
progress prize in Gansu province. And reseached, developed the
X62 1000-1 glass fine polishing machine at the same time). And
research, developed X61 812-1, X61 815-1 single side attenuate
machine, X62 812-1, X62 815-1 single side polishing machine.
On double side polishing equipment, researched and developed
X62 140P1D-1, X62 140P2D-1, X62 228P3D-1, X62 318P3D-1 double
side precision polishing series products. At present, Lanzhou
RAPID have successfully researched and developed the representative
digktal control series equipment like X61 1112K-1 digital precision
whetting machine. Use the new technic to extend the semiconductor
to fore-aft working procedure, raditon R&D, to increase
product variety, enlarge industry application field. |
